Job: Technical Program Manager - IC Packaging

Locations: Tempe, AZ & Sunnyvale, CA (On-site)

Compensation: $120,000- $170,000/year

Overview:

We are partnering with our long-time client, a global leader in semiconductor manufacturing and packaging solutions, on a new Technical Program Manager (TPM) opening focused on IC Packaging.

The role will play a key part in bridging local customers with our client's global factory operations, supporting NPI and production execution, and driving packaging solutions for cutting-edge technologies in AI, robotics, power, and medical sectors.

Job Duties:

• Support local sales teams in developing strategies to drive new business and expand market penetration for multinational IC packaging and testing services.
• Promote our client's capabilities by helping customers identify the most suitable factory locations to meet their business and technical needs.
• Serve as the main liaison between U.S.-based customers and our client's global factories to manage NPI (New Product Introduction), production schedules, engineering queries, and quality issues.
• Analyze semiconductor packaging trends across AI, power, robotics, and medical markets.
• Help customers translate product concepts into practical IC packaging solutions.
• Provide technical recommendations for advanced packaging types including FCCSP (C2iM), WDBGA, and WLCSP.
• Collaborate with customers on technology roadmaps, resolve quality issues, and lead recurring business reviews.
• Organize and host regular meetings between customers and factory teams to ensure alignment on project progress and goals.
• Conduct site visits to customer locations to present technology updates and promote future product developments.

Requirements:

• Bachelor's degree in Business Administration or related field.
• Minimum 2 years' experience in a relevant TPM or Section Manager role within the semiconductor packaging industry.
• Strong background in NPI management and packaging technologies including:
  • FCCSP (C2iM - Fan-Out Chip-on-Carrier)
  • WDBGA (Wafer-Level Die Ball Grid Array)
  • WLCSP (Wafer-Level Chip-Scale Package)

All qualified applicants will receive consideration for employment without regard to race, color, national origin, age, ancestry, religion, sex, sexual orientation, gender identity, gender expression, marital status, disability, medical condition, genetic information, pregnancy, or military or veteran status. We consider all qualified applicants, including those with criminal histories, in a manner consistent with state and local laws, including the California Fair Chance Act, City of Los Angeles' Fair Chance Initiative for Hiring Ordinance, and Los Angeles County Fair Chance Ordinance. For unincorporated Los Angeles county, to the extent our customers require a background check for certain positions, the Company faces a significant risk to its business operations and business reputation unless a review of criminal history is conducted for those specific job positions.